Effective EMI control prevents spurious signals from entering or
leaving an enclosure. Shields and filters are the predominant techniques
for controlling EMI.
Shields can involve many combinations of
foils, conductive inks, paper, and adhesives. For example, there are now
shields that consist of silver ink printed on 5-mil-thick polyester.
After printing, a curing process removes nonconductive solvents. The
result is a homogeneous shield that does not crack or delaminate when
bent. The shield can be mechanically fastened and grounded with solder
tabs. The cost is about the same as that for conventional laminated
designs.
Carbon and stainless-steel fibers, combined with
thermoplastics, provide an effective shield in many applications. Carbon
fibers are usually classified as either PAN (polyacrylonitrile) or
pitch. PAN fiber composites are selected for their high strength. Also,
because PAN fiber has a higher aspect ratio (length to diameter ratio)
than pitch, less is needed to provide a given conductivity.
Pitch-based
fibers are not as strong as low-modulus PAN fibers. However, pitch
fibers process easily into high-modulus products, making them attractive
for stiffness-critical and thermally sensitive applications. The third
carbon additive commonly used is carbon black. Carbon-black plastics are
inexpensive, and are primarily for applications requiring high surface
conductivity that allows dissipation of static charge.
Five
factors affect plastic conductivity. The first is fill aspect ratio,
which is proportional to conductivity. Second is loading level, also
proportional to conductivity. The lowest fill loading needed to produce
conductivity (generally defined as 105Ω/sq) is called the critical concentration.
The
third factor is resin type. The amount of fill needed for the critical
concentration depends on the resin. For example, because nylon has a
crystalline structure, its surface becomes conductive at lower fill
concentrations than materials such as amorphous polycarbonate.
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